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Manufacturer	MICROCHIP TECHNOLOGY
Type of semiconductor module	MOSFET transistor
Semiconductor structure	SiC diode/transistor
Drain-source voltage	1.2kV
Drain current	268A
Case	SP3F
Topology	MOSFET half-bridge + parrallel diodes, NTC thermistor
Electrical mounting	Press-in PCB
On-state resistance	7.8mΩ
Pulsed drain current	675A
Power dissipation	1.409kW
Technology	SiC
Mechanical mounting	screw

MSCSM120AM08CT3AG

Module; SiC diode/transistor; 1.2kV; 268A; SP3F; Press-in PCB

Specification

Transfer Multisort Elektronik Sp. z o.o. is an importer of products of this brand