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10-6327-01G

Heatsink: attachable; grilled; BGA,FPGA; black; L: 28.5mm; W: 28.5mm

Manufacturer: BOYD CORP

Manufacturer part number:
10-6327-01G
TME Symbol:
10-6327-01G

Specification

Manufacturer
BOYD CORP
Type of heatsink
attachable
Heatsink shape
grilled
Application
BGA, FPGA
Colour
black
Length
28.5mm
Width
28.5mm
Height
10mm
Material
aluminium
Material finishing
anodized
Gross weight1 g
Certificates
See other products in this category: Heatsinks BOYD CORP,
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10-6327-01G
0 in TME stock
Net price for quantities from 600 pcs - 1.85 USDGross price for quantities from 600 pcs - 1.85 USD
No. of pieces (Multiplicity: 600)