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374224B00035G

Heatsink: extruded; BGA,FPGA; L: 23mm; W: 23mm; H: 25mm; aluminium

Manufacturer: BOYD CORP

Manufacturer part number:
374224B00035G
TME Symbol:
374224B00035G

Specification

Manufacturer
BOYD CORP
Type of heatsink
extruded
Application
BGA, FPGA
Length
23mm
Width
23mm
Height
25mm
Material
aluminium
Gross weight1 g
Certificates
See other products in this category: Heatsinks BOYD CORP,
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374224B00035G
0 in TME stock
Net price for quantities from 420 pcs - 2.31 USDGross price for quantities from 420 pcs - 2.31 USD
No. of pieces (Multiplicity: 1)