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THT (Through Hole Technology) is a conventional method of mounting electronic components, based on inserting leaded elements through holes drilled in a printed circuit board (PCB), followed by soldering on the opposite side. This technique was widely used from the 1950s until the rise of Surface-Mount Technology (SMT), but it still finds application in scenarios requiring high mechanical reliability, resistance to environmental conditions, and ease of servicing.
Components mounted using THT typically have long leads in the form of wires or pins, which pass through plated through-holes in the PCB. Their electrical and mechanical connections are established by soldering to the copper layer on the underside of the board. This construction provides high mechanical strength, especially under conditions of vibration, shock, or thermal cycling, making it the preferred technology in automotive, power electronics, military, and industrial equipment.
From a technological perspective, THT requires drilling holes in the PCB, which increases production time and cost compared to surface mounting. It also limits component density, as the leads need physical space to pass through the substrate. Nevertheless, the technology remains suitable for mounting large components such as transformers, connectors, electrolytic capacitors, or elements requiring frequent replacement or testing.
In modern manufacturing environments, THT assembly can be performed manually, semi-automatically, or using wave soldering machines that allow simultaneous soldering of multiple joints on the bottom side of the board. The integration of THT and SMT within a single design is a common practice in mixed-technology electronics, where each method is selected according to specific technical and structural requirements.
Transfer Multisort Elektronik (TME) is one of the world’s largest global distributors of electronic components, electrotechnical parts, workshop equipment, and industrial automation. The catalog includes over 1,500,000 products from 1,300 leading manufacturers. TME’s modern logistics centers in Łódź and Rzgów (Poland), with a combined area of over 40,000 m², ship nearly 6,000 packages daily to customers in more than 150 countries.
TME also invests in the development of knowledge and skills of young engineers and electronics enthusiasts through the TME Education project, and supports the tech community by organizing the TechMasterEvent series, promoting innovation and experience exchange.