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Manufacturer: BOYD CORP
Manufacturer | BOYD CORP | |
Type of heatsink | extruded | |
Heatsink shape | grilled | |
Application | BGA, FPGA | |
Colour | green | |
Length | 37.4mm | |
Width | 37.4mm | |
Height | 6mm | |
Material | aluminium | |
Material finishing | anodized |