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PLCC (Plastic Leaded Chip Carrier) - definition

PLCC (Plastic Leaded Chip Carrier) is a type of integrated circuits enclosure, made of plastic, characterised by the presence of leads in the form of flexible J-leads, bent under the bottom of the enclosure. This design allows surface-mounting (SMD - Surface-Mount Device) on printed circuit boards, as well as - in some cases - placement in special sockets (sockets), which facilitates replacement or testing of chips without the need for soldering.

Enclosures of the PLCC type are usually square or rectangular and contain a dozen to several dozen leads distributed around all four sides of the enclosure. Their compact form factor allows for a higher density of components on the board surface, which is important in space-constrained designs such as mobile devices, embedded systems, controllers or consumer electronics.

Compared to previous solutions, such as Dual In-line Package (DIP) Enclosures, PLCC offers a smaller footprint while maintaining a similar number of connections, while allowing for improved electrical performance, such as reduced inductance and path resistance. Enclosures also provide greater mechanical resistance during assembly and better heat dissipation due to direct adhesion to the PCB surface.

PLCC was widely used in the 1980s and 1990s, particularly in microprocessors, EPROM/EEPROM memories, programmable logic and controllers. Today, it has been partially displaced by more advanced enclosure types such as QFP, TQFP or BGA, which offer higher interconnect density and better thermal properties. Nevertheless, because of its ability to be disassembled without disturbing the soldered connections, PLCC is still used in some service, educational and equipment applications requiring periodic component replacement.

Transfer Multisort Elektronik (TME) is one of the world’s largest global distributors of electronic components, electrotechnical parts, workshop equipment, and industrial automation. The catalog includes over 1,500,000 products from 1,300 leading manufacturers. TME’s modern logistics centers in Łódź and Rzgów (Poland), with a combined area of over 40,000 m², ship nearly 6,000 packages daily to customers in more than 150 countries.

TME also invests in the development of knowledge and skills of young engineers and electronics enthusiasts through the TME Education project, and supports the tech community by organizing the TechMasterEvent series, promoting innovation and experience exchange.

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