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System on Chip (SoC) is an integrated circuit containing a complete computer or electronic system in the form of a single chip. It combines a variety of functional components such as central processing unit (CPU), memory chips, communication modules, signal processors (DSP), peripheral controllers, and often graphics modules (GPU), networking chips, analogue-to-digital converters and other specialised components in a single semiconductor structure.
The SoC architecture is designed for maximum miniaturisation, low power consumption and high performance with limited hardware resources. By integrating multiple functions on a single silicon wafer, it is possible to reduce the number of external connections, shorten data access times and reduce manufacturing costs and space requirements. The SoC is mainly used in mobile devices such as smartphones, tablets, smart watches, routers or media kits, as well as in embedded systems and solutions Internet of Things (IoT).
The development of SoC design technology is based on advanced Integrated circuits engineering methods such as IP block integration, hardware modelling in HDL languages (e.g. VHDL, Verilog) and automated synthesis and test tools. In contrast to classical microprocessor chips, SoCs offer a more complex functional structure, often optimised for a specific application. In many cases, it includes dedicated hardware accelerators that significantly increase the efficiency of processing specific types of data, e.g. video, audio or network coding.
The SoC can interact with external memory, Displays, sensors or communication interfaces, but its core functions are performed independently, making it the central unit in modern electronic systems with a high degree of integration and autonomous operation.
Transfer Multisort Elektronik (TME) is one of the world’s largest global distributors of electronic components, electrotechnical parts, workshop equipment, and industrial automation. The catalog includes over 1,500,000 products from 1,300 leading manufacturers. TME’s modern logistics centers in Łódź and Rzgów (Poland), with a combined area of over 40,000 m², ship nearly 6,000 packages daily to customers in more than 150 countries.
TME also invests in the development of knowledge and skills of young engineers and electronics enthusiasts through the TME Education project, and supports the tech community by organizing the TechMasterEvent series, promoting innovation and experience exchange.