+1 500 000 products in offer

7000 packages per day

+300 000 clients from 150 countries

Quick Buy Favourites
Cart

Due to air traffic closures or restrictions in the Middle East region, we would like to inform you of supply difficulties and the possibility of order delays.
We apologise for any inconvenience.

IMPORTANT: All international orders are subject to customs and duty fees as defined by the country of import. Customs and duty fees are not included in your TME order and/or shipping total. TME is not responsible for fees associated with import. All fees must be paid by the parcel recipient. Orders shipped and unclaimed or refused by customers will be managed under the TME protocol.

374124B00035G

Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm

Manufacturer: BOYD CORP

Manufacturer part number:
374124B00035G
TME Symbol:
374124B00035G

Specification

Manufacturer
BOYD CORP
Type of heatsink
extruded
Heatsink shape
grilled
Application
BGA, FPGA
Colour
black
Length
23mm
Width
23mm
Height
18mm
Thermal resistance
23.4K/W
Material
aluminium
Material finishing
anodized
Gross weight6.62 g
Certificates
See other products in this category: Heatsinks BOYD CORP,
*
374124B00035G
1096 in TME stock
Net price for quantities from 1 pcs - 2.00 USDGross price for quantities from 1 pcs - 2.00 USD
Net price for quantities from 10 pcs - 1.80 USDGross price for quantities from 10 pcs - 1.80 USD
Net price for quantities from 100 pcs - 1.71 USDGross price for quantities from 100 pcs - 1.71 USD
No. of pieces (Multiplicity: 1)
Packaging method by the manufacturerTray = 80 pcsCardboard = 560 pcs